TOTALPOS Production Flow

Place the TOTALPOS PCB board correctly on the solder paste printing machine and print the solder paste on the PCB board with the solder paste brush tool.

SMT on the TOTALPOS Printed Circuit Board.

Pass through the furnace at 260 degrees to melt the solder paste and stick each component pin to the pad.

Compared standard MB with this one, check whether there are defects and improve the yield.

Place the PCB on the furnace carrier, and manually place the plug-in material in the corresponding position.

Through the furnace again, through 260 degrees high temperature wave soldering to fix the plug-in material on the board .

Compared standard MB with this one, check whether there are defects and improve the yield.

Through the communication and interaction between the main test equipment and the test equipment, to test whether there are bad open and short circuit problems or not, and further improve the product quality.

Part of the products is sprayed with Conformal Coating and then let it dry.

Power on the motherboard and use the burning tool to burn the program. If failed, return to the maintenance department to find the problem. If successful,contibue to next step.

Put the motherboard in the POS machine and lock it with screws, connect firmly, and shell assembly.

Pre-installed testing software for all functional testing, printing, scanning, touch, sensitivity testing... different steps according to the customer order.

Aging for at least 48h to well control the quality again.

Label,pack and mark.